tailieunhanh - Contact angle of Sn-8Zn-3Bi lead-free solder alloy on copper substrate

The wettability of Sn-8Zn-3Bi lead free solder alloy on the copper substrate was evaluated via measuring the contact angle of the solder and the substrate. The measured contact angle was then compared to the contact angle of the traditional and widely used eutectic Sn-37Pb solder alloy. Experiments to study the effect of temperature, flux, and surface roughness of the substrate on the contact angle were also carried out. |