tailieunhanh - MECHANICAL ENABLING FOR THE INTEL@ PRNTIUM 4 PROCESSOR IN THE 478-PIN PACKAGE

In the additive RP processes, photopolymer systems are based on suc- cessively depositing thin layers of a liquid resin, which are then solidi- fied by exposure to a specific wavelengths of light. Thermoplastic sys- tems are based on procedures for successively melting and fusing solid filaments or beads of wax or plastic in layers, which harden in the air to form the finished object. Some systems form layers by applying adhe- sives or binders to materials such as paper, plastic powder, or coated ceramic beads to bond them. The first commercial RP process introduced was stereolithography in 1987, followed by a succession of others. Most of the commercial RP processes. | Mechanical Enabling for the Intel Pentium 4 Processor in the 478-Pin Package October 2001 Order Number 290728-001 intel Copyright 2001 Intel Corporation Disclaimers Information in this document is provided in connection with Intel products. No license express or implied by estoppel or otherwise to any intellectual property rights is granted by this document. Except as provided in Intel s Terms and Conditions of Sale for such products Intel assumes no liability whatsoever and Intel disclaims any express or implied warranty relating to sale and or use of Intel products including liability or warranties relating to fitness for a particular purpose merchantability or infringement of any patent copyright or other intellectual property right. Intel products are not intended for use in medical life saving or life sustaining applications. Intel may make changes to specifications and product descriptions at any time without notice. The Intel Pentium 4 Processor may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. All dates products and plans are preliminary and subject to change. Intel accepts no liability for the implementation of these methods as implemented within the customer s own manufacturing environment. Furthermore any third party suppliers named herein are provided for informational use only. Intel accepts no liability for the quality of third party supplier products and services and cannot guarantee the correct or suitable operation of third party products. The hardware vendor remains solely responsible for the design manufacture sale and functionality of its products including any liability arising from product infringement or product warranty. Each hardware vendor is responsible for providing their respective product data. Intel does not publish vendors test results product specifications price projections or schedules. The hardware .

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