tailieunhanh - Intel ® Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket

Most of the RP technologies are additive; that is, the model is made automatically by building up contoured laminations sequentially from materials such as photopolymers, extruded or beaded plastic, and even paper until they reach the desired height. These processes can be used to form internal cavities, overhangs, and complex convoluted geometries as well as simple planar or curved shapes. By contrast, a subtractive RP process involves milling the model from a block of soft material, typi- cally plastic or aluminum, on a computer-controlled milling machine with commands from a CAD-derived program | Intel Core Ì7-8O0 and Ì5-70O Desktop Processor Series and LGA1156 Socket Thermal Mechanical Specifications and Design Guidelines September 2009 Document Number 322167-002 jntei INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMeNt. except as PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS including LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical life saving or life sustaining applications. Intel may make changes to specifications and product descriptions at any time without notice. Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined. Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The Intel Core i7-800 and i5-700 desktop processor series and Intel 5 Series Chipset and LGA1156 socket may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel Core and the Intel logo are trademarks of Intel Corporation in the and other countries. Other brands and names may be claimed as the property of others. Copyright 2009 Intel Corporation. 2 Thermal Mechanical Specifications and Design Guidelines jntei Contents 1 Definition of 2 Package Mechanical and