tailieunhanh - Handbook of Semiconductor Interconnection Technology - Second Edition

Since the first edition of this handbook, semiconductor technology has gone through a continued evolution of new devices and materials like never before. Wafer sizes continue to grow with most of the new fabs equipped for 12-inch wafers. The changes are triggered by many considerations: continued need to provide more functions at lower cost; technology features less than 1000 Å requiring new processes, and exponential increase in the number of device elements. At the device level, the field effect transistor (FET) speed is continually improved by things such as use of insulating substrates, straining the silicon (channel region), and use of dual- and triple-gate (FINFET) structures. The. | HANDBOOK OF SEMICONDUCTOR INTERCONNECTION TECHNOLOGY Second Edition 2006 by Taylor Francis Group LLC HANDBOOK OF SEMICONDUCTOR INTERCONNECTION TECHNOLOGy Second Edition EDITED By GERALDINE C. SCHWARTZ KRIS V. SRIKRISHNAN Taylor Francis Taylor Francis Group Boca Raton London New York A CRC title part of the Taylor Francis imprint a member of the Taylor Francis Group the academic division of T F Informa plc. 2006 by Taylor Francis Group LLC Published in 2006 by CRC Press Taylor Francis Group 6000 Broken Sound Parkway NW Suite 300 Boca Raton FL 33487-2742 2006 by Taylor Francis Group LLC CRC Press is an imprint of Taylor Francis Group No claim to original . Government works Printed in the United States of America on acid-free paper 10 987654321 International Standard Book Number-10 1-57444-674-6 Hardcover International Standard Book Number-13 978-1-57444-674-6 Hardcover Library of Congress Card Number 2005054909 This book contains information obtained from authentic and highly regarded sources. Reprinted material is quoted with permission and sources are indicated. A wide variety of references are listed. Reasonable efforts have been made to publish reliable data and information but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their use. No part of this book may be reprinted reproduced transmitted or utilized in any form by any electronic mechanical or other means now known or hereafter invented including photocopying microfilming and recording or in any information storage or retrieval system without written permission from the publishers. For permission to photocopy or use material electronically from this work please access http or contact the Copyright Clearance Center Inc. CCC 222 Rosewood Drive Danvers MA 01923 978-750-8400. CCC is a not-for-profit organization that provides licenses and registration for a variety of users. For organizations that have