tailieunhanh - Ultra Wideband Communications Novel Trends System, Architecture and Implementation Part 11

Tham khảo tài liệu 'ultra wideband communications novel trends system, architecture and implementation part 11', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | 240 Ultra Wideband Communications Novel Trends - System Architecture and Implementation 4. LTCC structure and indicate the LTCC structure of the filter. The filter is obtained by means of modifying the structure based on the basic circuit shown in taking into consideration the various parasitic effects caused by the three-dimensional LTCC structure. The filter consists of the three conductor layers inserted into the middle portion of the LTCC substrate with the ground planes on the top and bottom layers. The conductor thickness is 8 um. The diameter of via holes is mm. The ground planes are connected by the via holes. The via hole between the coupled line adjusts the coupling condition. The dimensions of the bandpass filter are x x mm3 and this size could be fabricated into the LTCC substrate for wireless modules. shows the simulated results using a commercial electromagnetic simulator HFSS Ansys Inc. . The filter has the wide passband and suppresses second and third harmonics. The filter also has an additional attenuation pole at the low-frequency region. Fig. 10. Three-dimensional structure of the filter. Fig. 11. Cross sectional structure of the filter. A Method for Improving Out-Of-Band Characteristics of a Wideband Bandpass Filter in an LTCC Substrate 241 Unit mm Via hole Fig. 12. Top view of the filter. r F 1