tailieunhanh - Bio-MEMS Technologies and Applications - Wang and Soper (Eds) Part 2

Tham khảo tài liệu 'bio-mems technologies and applications - wang and soper (eds) part 2', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | UV Lithography of Ultrathick SU-8 23 1. Clean Si wafer with acetone IPA isopropyl alcohol and DI deionized water. 2. Spin coat SU-8 100 at 400 rpm. 3. Level hot plate bake 10 hours at 110 C cool down to 60 C inside 1 hour dwell at 55 C uncross-linked SU-8 s glass temperature is 50 C to approximately 60 C for 4 hours cool down to room temperature inside 3 hours. 4. Expose the sample using a broadband light source with spectrum as shown in Figure includes the z-line Mine and g-line with total exposure dosage of 2 J cm2 for PMMA filter wavelength selection exposure with spectrum as shown in Figure includes the Mine and g-line with total exposure dosage 12 J cm2. 5. Postbake at 110 C for 20 minutes cool down as in step 3. 6. Develop sample using SU-8 developer at 32 C with SONOSYS megasonic actuator driven with a 250 W power supply for 2 hours. The megasonic transducer was placed in a water bath supporting a quartz tank in which the developer and substrate were located. Wafers were facing the megasonic actuator. 7. Rinse sample with IPA several times dry naturally. To measure the sidewall quality of the microstructures fabricated using filtered a light source and gap compensation a 20 pm feature-sized microstructure with a flat edge was removed from the substrate and placed on the measurement stage of the Veeco optical profiler. The Rg roughness of standard deviation was then measured along the 1150 pm length. It was found that the roughness of standard deviation in the light incident direction was pm over the entire length of 1150 pm. Figure shows a group of microcrosses produced with different conditions a broadband light source with no air gap compensation b broadband light source and air gap compensation using a glycerin solution c the filtered light source z-line eliminated with no air gap compensation and d filtered light source with gap compensation using a glycerin solution. The minimum designed thicknesses of the crosses achieved are 20 pm for

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