tailieunhanh - Silicon Carbide Materials Processing and Applications in Electronic Devices Part 14

Tham khảo tài liệu 'silicon carbide materials processing and applications in electronic devices part 14', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | Application of Silicon Carbide in Abrasive Water Jet Machining 445 Fig. 14. Contamination at different zones and at different pressures. 446 Silicon Carbide - Materials Processing and Applications in Electronic Devices Experiment 5 Zone A Zone B Zone C Pressure 30 kpsi Flow rate 5 g s Feed rate 20mm min Contaminations 6 3 7 Experiment 6 Zone A Zone B Zone C Pressure 30 kpsi Flow rate 10 g s Feed rate 10 mm min Contamination 5 6 6 Experiment 13 Zone A Zone B Zone C Pressure 40 kpsi Flow rate 5 g s Feed rate 40 mm min Contamination 17 10 18 Experiment 16 Zone A Zone B Zone C Pressure 40 kpsi Flow rate 20 g s Feed rate 10 mm min Contamination 11 4 6 Table 2. Embedding of the .

TỪ KHÓA LIÊN QUAN