tailieunhanh - Báo cáo hóa học: " Silicon Encapsulated Carbon Nanotubes"

Tuyển tập báo cáo các nghiên cứu khoa học quốc tế ngành hóa học dành cho các bạn yêu hóa học tham khảo đề tài: Silicon Encapsulated Carbon Nanotubes | Nanoscale Res Lett 2010 5 74-80 DOI s11671-009-9446-z NANO EXPRESS Silicon Encapsulated Carbon Nanotubes Sri Lakshmi Katar Azlin Biaggi Labiosa Amairy E. Plaud Edgar Mosquera-Vargas Luis Fonseca Brad R. Weiner Gerardo Morell Received 25 May 2009 Accepted 24 September 2009 Published online 9 October 2009 to the authors 2009 Abstract A dual stage process of depositing bamboo-like carbon nanotubes BCNTs by hot filament chemical vapor deposition HFCVD and coating Si using Radio frequency sputtering RFS technique. The films were characterized by scanning electron microscopy SEM transmission electron microscopy TEM Raman spectroscopy X-ray photoelectron spectroscopy XPS and electron field emission studies EFE . SEM results suggest a dense network of homogeneous silicon-coated BCNTs. From the comprehensive analysis of the results provided by these techniques emerges the picture of Si encapsulated BCNTs. Keywords BCNTs Silicon coated Sputtering S. L. Katar E. Mosquera-Vargas L. Fonseca B. R. Weiner G. Morell Institute for Functional Nanomaterials University of Puerto Rico San Juan PR USA S. L. Katar El A. E. Plaud B. R. Weiner Department of Chemistry University of Puerto Rico . Box 23323 San Juan PR 00931 USA e-mail srilakshmikatar@ E. Mosquera-Vargas L. Fonseca G. Morell Department of Physics University of Puerto Rico . Box 23343 San Juan PR 00931 USA A. B. Labiosa Sensors and Electronics Branch Instrumentation and Controls Division National Aeronautics and Space Administration Glenn Research Center 21000 Brookpark Road Cleveland OH 44135 USA Introduction Silicon is an important material due to its role as the fundamental component in integrated circuits microelectronics and in lithium ion batteries. Continuous efforts have been focused on investigating the nanostructures of silicon for unveiling the properties and miniaturizing the microelectronics devices including the goal of integrating the electronics and photonics on the same Si chip. To .