tailieunhanh - Three-Dimensional Integration and Modeling Part 12

Tham khảo tài liệu 'three-dimensional integration and modeling part 12', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | REFERENCES 101 22 P. Ferrand D. Baillargeat S. Verdeyme J. Puech M. Lahti andT. Jaakola LTCC reduced-size bandpass filters based on capacitively loaded cavities for Qband application in 2005 IEEE MTT-S Int. Microwave Sym. Dig Long Beach CA. June 2005 pp. 1789-1792. 23 X. Gong W. J. Chappell and L. P. B. Katehi Multifunctional Substrates For High-Frequency Applications IEEE Microwave and Wireless Components Letters Vol. 13 No. 10 pp. 428-430 Oct. 2003 doi . 24 Y. C. Lee W. -I. Chang Y. H. Cho and C. S. Park A Very Compact 60GHz Transmitter Integrating GaAs MMICs on LTCC Passive Circuits for Wireless Terminals Applications in 2004 IEEE MTT-S Int. Microwave Sym. Dig Fort Worth TX. Oct. 2004 pp. 313-316 doi . 25 K. Ohata T. Inoue M. Funabashi A. Inoue Y. Takimoto T. Kuwabara S. Shi-nozaki K. Maruhashi K. Hosaya and H. Nagai Sixty-GHz-Band Ultra-Miniature Monolithic T R Modules for Multimedia Wireless Communication Systems IEEE Transaction on Microwave Theory and Technique vol. 44 no. 12 pp. 2354-2360 Dec. 1996 doi . 26 K. Ohata K. Maruhashi M. Ito S. Kishimoto K. Ikuina T. Hashiguchi K. Ikeda and N. Takahashi Gbps Wireless Gigabit Ethernet Link at 60 GHz-Band in 2003 IEEE MTT-S Int. Microwave Sym. Dig Philadelphia PA June 2003 pp. 373-376. 27 J. Mizoe S. Amano T. Kuwabara T. Kaneko K. Wada A. Kato K. Sato and M. Fujise Miniature 60 GHz Transmetter Receiver Modules on AIN Multi-Layer High Temperature Co-Fired Ceramic in 1999 IEEE MTT-S Int. Microwave Sym. Dig Anaheim CA June 1999 pp. 475-478 doi . 28 A. Tavakoli N. Darmvandi and R. M. Mazandaran Analysis of cross-shaped dual-polarized microstrip patch antennas in 1995 IEEE AP-S Int. Sym. Dig. Newport Beach CA. June 1995 pp. 994-997 doi . 29 M. F. Davis A. Sutono A. Obatoyinbo S. Chakraborty K. Lim S. Pinel J. Laksar and R. Tummala Integrated RF architectures in fully-organic SOP technology in Proc.