tailieunhanh - composite 2012 Part 11

Tham khảo tài liệu 'composite 2012 part 11', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | ACF Curing Process Optimization for Chip-on-Glass COG Considering Mechanical and Electrical Properties of Joints 193 Curing Degree Test No. Time of Contact Resistance Degradation Testing Days 0 3 6 9 12 1 298 573 1337 NA 1687 80 2 218 958 1053 NA 1518 3 273 855 1728 NA 1428 4 168 NA 938 NA 1033 1 278 550 735 NA 883 85 2 225 705 740 NA 755 3 215 752 1070 NA 1128 4 195 763 885 NA 1143 1 168 NA 758 NA 1100 90 2 250 NA 878 NA 1263 3 315 650 1037 NA 1363 4 148 815 948 NA 1493 1 373 958 NA 1185 1580 95 2 205 488 NA 903 1278 3 355 1270 NA 2288 2210 4 138 290 NA 715 1350 Table 1. Contact resistances of specimens during the 85 C 85 RH hygrothermal test for various curing degrees unit mQ Fig. 2. Weibull distribution of contact resistance degradation data for each group of specimens characterized by different curing degree a 194 New Developments in Liquid Crystals observation time. From figure 2 it can be seen that for each group specimens most of the data fall on the straight-line plots except for several occasional outliers. This suggests that the two-parameter weibull distribution is a reasonable candidate to model the contact resistance degradation data of ACF joints so the probability density function PDF of the contact resistance of specimens can be given by 1 Herein t is the hygrothermal testing time p and n are the shape parameter and scale parameter of the weibull distribution respectively. Usually both p and n are timedependent and can be expressed as a certain function of the hygrothermal testing time t. The shape and scale parameters of each weibull distribution plot corresponding to different curing degree are recorded as listed in table 2. Curing Degree Distribution Parameters Time of Contact Resistance Degradation Testing Days 0 3 6 9 12 80 p NA 1 mil NA 1536 46 Q 0 p NA 1 mil NA 90 p NA 1 mil NA 95 p NA