tailieunhanh - Adaptive Techniques for Dynamic Processor Optimization Theory and Practice Episode 2 Part 7

Tham khảo tài liệu 'adaptive techniques for dynamic processor optimization theory and practice episode 2 part 7', kỹ thuật - công nghệ, cơ khí - chế tạo máy phục vụ nhu cầu học tập, nghiên cứu và làm việc hiệu quả | Chapter 12 The Challenges of Testing Adaptive Designs Eric Fetzer Jason Stinson Brian Cherkauer Steve Poehlman Intel Corporation In this chapter we describe the adaptive techniques used in the Itanium 2 9000 series microprocessor previously known as Montecito 1 . Montecito features two dual-threaded cores with over MB of total on die cache in a 90nm process technology 2 with seven layers of copper interconnect. The die shown in Figure is 596 mm2 in size contains billion transistors and consumes 104 W at a maximum frequency of GHz. To manufacture a product of such complexity a sophisticated series of tests are performed on each part to ensure reliable operation throughout its service at a customer installation. Adaptive features often interfere with these tests. This chapter discusses three adaptive features on Montecito active de-skew for reliable low skew clocks Cache Safe Technology for robust cache operation and Foxton Technology for power management. Traditional test methods are discussed and the specific impacts of active de-skew and the power measurement system for Foxton are highlighted. Finally we analyze different power management systems and consider their impacts on manufacturing. The Adaptive Features of the Itanium 2 9000 Series Active De-skew The large die of the Montecito design results in major challenges in delivering a low skew global clock to all of the clocked elements on the die. Unintended clock skew directly impacts the frequency of the design by shortening the sample edge of the clock relative to the driving edge of a different clock. Random and systematic process variation in both the A. Wang S. Naffziger eds. Adaptive Techniques for Dynamic Processor Optimization DOI 978-0-387-76472-6_12 Springer Science Business Media LLC 2008 274 Eric Fetzer Jason Stinson Brian Cherkauer Steve Poehlman mm mm Figure Montecito die micrograph. transistor and metal layers makes it difficult to accurately

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