tailieunhanh - Printed Circuit Boards: Design, Fabrication, and Assembly

They now include finer conductor tracks and thinner laminates, present in an ever-increasing number of layers. Integrated circuits have become dramatically sophisticated especially in the last decade. This has in turn created new design requirements for mounting them on the boards. While insertion was common with DIP (dual in- line-package) technology in the 1970s, surface mount technology in now being increasingly employed. holes is increasing; and hole diameters are rapidly decreasing. | McGraw-Hill ELECTRONIC ENGINEERING EltCTKONIC CNCINCCtING Printed Circuit Boards DESIGN FABRICATION AND ASSEMBLY High density interconnects CAD CAM techniques Laminates Soldering R. s. Khandpur PRIQTED cir_c_uJi BOARDS Design Fabrication Assembly and Testing This page intentionally left .

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