tailieunhanh - MEMS Mechanical Sensors

As with micromachining processes, many MEMS sensor-packaging techniques are the same as, or derived from, those used in the semiconductor industry. However, the mechanical requirements for a sensor package are typically much more stringent than for purely microelectronic devices. Microelectronic packages are often generic with plastic, ceramic, or metal packages being suitable for the vast majority of IC applications. | M E M s MICROELECTROMECHANICAL SYSTEMS SERIES Stephen Beeby Graham Ensell Michael Kraft Neil White MEMS Mechanical Sensors For a listing of recent titles in the Artech House Microelectromechanical Systems MEMS Series turn to the back of this .

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