tailieunhanh - Surface modification by electrical discharge machining A review
(BQ) This paper presents a review on the phenomenon of surface modification by electric discharge machining and future trends of its applications. | Journal of Materials Processing Technology 209 (2009) 3675–3687 Contents lists available at ScienceDirect Journal of Materials Processing Technology journal homepage: Review Surface modification by electrical discharge machining: A review Sanjeev Kumar a,∗ , Rupinder Singh b , . Singh c , . Sethi d a Mechanical Engineering Department, Punjab Engineering College, Chandigarh 160012, India Mechanical & Production Engineering Department, Guru Nanak Dev Engineering College, Ludhiana, Punjab, India c Mechanical Engineering Department, Thapar University, Patiala, Punjab, India d Mechanical Engineering Department, Maharishi Markandeshwar University, Mullana, Haryana, India b a r t i c l e i n f o Article history: Received 14 February 2008 Received in revised form 16 September 2008 Accepted 18 September 2008 Keywords: Surface modification Electrical discharge machining EDM Powder metallurgy electrodes Surface finish a b s t r a c t The last decade has seen an increasing interest in the novel applications of electrical discharge machining (EDM) process, with particular emphasis on the potential of this process for surface modification. Besides erosion of work material during machining, the intrinsic nature of the process results in removal of some tool material also. Formation of the plasma channel consisting of material vapours from the eroding work material and tool electrode; and pyrolysis of the dielectric affect the surface composition after machining and consequently, its properties. Deliberate material transfer may be carried out under specific machining conditions by using either composite electrodes or by dispersing metallic powders in the dielectric or both. This paper presents a review on the phenomenon of surface modification by electric discharge machining and future trends of its applications. © 2008 Elsevier . All rights reserved. Contents 1. 2. 3. 4. 5. Introduction . . . . . . . . . . . . . . . . . . . . .
đang nạp các trang xem trước
