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Muller, R.S. “Microdynamic Systems in the Silicon Age” Handbook of Micro/Nanotribology. Ed. Bharat Bhushan Boca Raton: CRC Press LLC, 1999 © 1999 by CRC Press LLC Microdynamic Systems in the Silicon Age Richard S. Muller 13.1 Introduction Origins 13 13.2 Micromachining Substrate Micromachining • Surface Micromachining • Polycrystalline Silicon Properties • Tribology in MEMS 13.3 MEMS Structures and Systems MEMS Actuation Forces • MEMS for Microphotonics • Coupling Efficiency 13.4 Berkeley Microphotonics Research Acknowledgments References ABSTRACT With the proven record of accomplishment in very large integrated circuits (VLSI) brought about by batch-fabrication technology for electronic devices of ever-decreasing size, there is widespread enthusiasm about emerging opportunities to design mixed micromechanical and microelectronic systems | Muller R.S. Microdynamic Systems in the Silicon Age Handbook of Micro Nanotribology. Ed. Bharat Bhushan Boca Raton CRC Press LLC 1999 1999 by CRC Press LLC 13 Microdynamic Systems in the Silicon Age Richard S. Muller 13.1 Introduction Origins 13.2 Micromachining Substrate Micromachining Surface Micromachining Polycrystalline Silicon Properties Tribology in MEMS 13.3 MEMS Structures and Systems MEMS Actuation Forces MEMS for Microphotonics Coupling Efficiency 13.4 Berkeley Microphotonics Research Acknowledgments References ABSTRACT With the proven record of accomplishment in very large integrated circuits VLSI brought about by batch-fabrication technology for electronic devices of ever-decreasing size there is widespread enthusiasm about emerging opportunities to design mixed micromechanical and microelectronic systems. New development based heavily on integrated-circuit-related technologies have led to rapid progress in the development of microdynamic systems. These systems are based upon the science technology and design of moving micromechanical devices and are a subclass of what is known in the U.S. as microelectromechanical systems MEMS . The dimensions of the micromechanical devices in MEMS are typically smaller than 100 pm. Recent rapid progress gives promise for new designs of integrated sensors actuators and other devices that can be combined with on-chip microcircuits to make possible high-performing compact portable low-cost engineering systems. Mechanical materials for some of the microdynamic systems that have thus far been demonstrated consist of deposited thin films of polycrystalline silicon silicon nitride aluminum polyimide and tungsten among other materials. To make mechanical elements using thin-film processing microstructures are freed from the substrate by etching a sacrificial layer of silicon dioxide. First demonstrated as a means to produce electrostatically driven doubly supported beam bridges this sacrificial-layer technology has proved .