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Batch furnace chemical vapor deposition of pure boron layers on Si and GaN substrates for low-leakage-current diode fabrication

Boron deposition on both n-Si and n-GaN in the temperature range 250 - 500 °C, has been shown to form diodes with low saturation currents, i.e., electron injection from the n-substrate into the B-layer was efficiently suppressed. Moreover, down to 3-nm-thick B-layers on Si were shown to form a material barrier to Al, opening the possibility of fabricating Au-free gates for gallium-nitride high-electron-mobility transistors (GaN HEMTs). |